Next generation computers: new wiring material could transform chip technology

By Mark Greenaway, Senior Lecturer in Physics, Loughborough University
Fasil Dejene, Senior Lecturer in Physics, Loughborough University
Kelly Morrison, Professor of Experimental Physics, Loughborough University

The rapid technological advancements of our world have been enabled by our capacity to design and fabricate ever smaller electronic chips. These underpin computers, mobile phones and every smart device deployed to date.

One of the many challenges is that electronic components generate increasingly more heat as they are miniaturised. A significant issue lies in making the wires which connect the transistors on the chip thinner while ensuring that the minimum amount of heat is released.

These interconnects are typically made from copper, and as we start to scale them down…

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